III-V/III-N technologies for next generation high-capacity wireless communication

Bron
International Electron Devices Meeting (IEDM), DEC 03-07, 2022, San Francisco, CA- (2022) p. 1-4
Auteur(s)
    N. Collaert, A. Alian, A. Banerjee, G. Boccardi, P. Cardinael, V. Chauhan, C. Desset, R. ElKashlan, A. Khaled, M. Ingels, B. Kunert, Y. Mols, B. O'Sullivan, U. Peralagu, N. Pinho, R. Rodriguez, A. Sibaja-Hernandez, S. Sinha, X. Sun, A. Vais, B. Vermeersch, S. Yadav, D. Yan, H. Yu, Y. Zhang, M. Zhao, J. Van Driessche, G. Gramegna, P. Wambacq, B. Parvais, Michael Peeters